ELECTRONICS

According to the roadmap published by the IEEE, the distance between two metal interconnections, known also as ‘metal pitch’, gives an idea of the degree of miniaturisation that can be achieved in a microprocessor. This number is currently in the nanoscale, which allows more than 100 million mm2 transistors to be compacted. These performance levels are constantly being revised and improved according to the Moore’s law. There are therefore great opportunities for the future to improve the already high performance of the detection systems used in digital radiography, which applies in those areas where high resolutions are used.